Продукция

Automated assembly of printed circuit boards

Electronics contract manufacturing is based on original assembly lines for SMD components surface mounting and selective soldering. The mixed method significantly enhances the PCB assembly process quality, rate, accuracy, flexibility and versatility, and ensures execution of the project in compliance with requirements and in due time.

Оборудование для SMT

The company provides the following services:

  • Assembly of products ranging from prototypes and small lots to series-produced printed circuit boards;
  • Assembly of components (SMD components sized from 0.6 х 0.3 mm2 (0201) to 55 х 55 mm2 with 0.3 mm lead pitch, BGA components, mBGA, Flip-Chips, CSP);
  • Assembly of components (SIP, DIP components in output cases, components with axial and radial leads, non-standard and large-sized components and connectors).

Технология поверхностного монтажа

Assembly of SMD components is carried out through the automated surface mounting line (SMT). We can provide both one-sided and two-sided printed circuit board assembly. Our equipment is appropriate for processing the conventional printed circuit boards made of fabric-based laminate, the flexible boards and the aluminum and copper boards.

Автоматизированная линия

Automated assembly of BGA, mBGA, Flip-Chips, CSP and other complex components is performed with the use of special headers and well-tried techniques. Full reproducibility of the soldering procedure is strictly observed, ensuring a high level of assembling process quality in compliance with all required manufacturing parameters.

EleSy is specialized in assembling SIP, DIP components in output cases, components with axial and radial leads, non-standard and large-sized components and connectors. THT assembly of printed circuit boards is carried out through the automated selective soldering line. High precision monitoring and control of soldering parameters, absence of a human factor and state-of-the-art technologies ensure maximum efficiency, consistency of operation and eliminate occurrence of any defects.